PCB Capabilities
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Object
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Processing capacity(Metric)
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Note
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max panel size
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40＂x20＂（1016mm x508mm）
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innerlayer line width/space(min)
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3mil/3mil（76um/76um）
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min innerlayer clearance
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5mil（0.13mm）
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min innerlayer pad
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5mil（0.13mm）
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Referring to Weld Central relief
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min core thickness
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4mil（0.1mm）
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Non-Copper Foil
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min dielectric thickness
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3mil（76um）
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thickness of inner copper
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1/3oz、1/2oz、1oz、2oz、3oz
（12um、17um、35um、70um、105um） |
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thickness of outerlayer base copper
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1/3oz、1/2oz、1oz、2oz、3oz
（12um、17um、35um、70um、105um） |
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thickness of finished panel
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0.20-4.0mm
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tolerance of finished panel thickness
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Thickness＜1.0mm
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±12％
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4-8layer
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1.0mm≤Thickness2.0mm
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±8％
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4-8layer
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±10％
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≥10layer
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Thickness≥2.0mm
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±10％
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surface treating technic of innerlayer
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Black / brown oxidation
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layer number
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0～32
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registration of innerlayer to innerlayer
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±2mil（±50um）
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min drilling diameter
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0.20mm
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min diameter of finished hole
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0.15mm
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accuracy of hole position
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±2mil（±50um）
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tolerance of drilled slot
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±3mil（±75um）
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tolerance of PTH diameter
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±2mil（±50um）
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tolerance of NPTH diameter
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±1mil（±25um）
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max A.R. of PTH
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10：1
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PTH hole copper thickness
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0.4-2mil（10-50um）
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image to image tolerance
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±3mil（0.075mm）
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outer layer line width/space(min)
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3mil/3mil(76um/76um)
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tolerance of line width
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±1mil（±25um）
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type of solder mask
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Green/Red/Yellow/Black/Purple/White/Matt Green/Matt Black etc
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thickness of solder mask
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Top Line
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0.4-1.2mil（10-30um）
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Line corner
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≥0.2mil（5um）
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Substrates
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≤thick copper+1.2mil
(≤thick copper+30um) |
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solder mask registration tolerance
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±2mil（50um）
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min solder mask dam
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3.0mil（75um）
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max solder mask plug hole diameter
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0.8mm
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surface treating technics
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HASL-LF.OSP.immersion gold,Plating Gold,immersion Ag
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max nickle thickness of gold finger
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280u″（7um）
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max gold thickness of gold finger
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60u″（1.5um）
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range of nickle thickness
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100u″/240 u″（2.5um/6um）
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range of gold thickness
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1u″/6 u″（0.05um/0.15um）
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min routing dimension tolerance(edge to edge)
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±4mil(±0.10mm)
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min routing dimension tolerance(hole to edge)
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±3mil（0.075mm）
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V-cut angle
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30°，45°，60°, 90°
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range of bevel angle
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20°～60°
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min legend line width/space
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5mil/5mil（0.125mm/0.125mm）
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peel strength of line
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≥6lB/in（≥107g/mm）
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ionic contamination
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＜1.0ugNaCl/cm2
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impedance control and tolerance
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50Ω±10%
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bow and twist
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≤0.5%
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type of dielectric material
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CEM3、FR-4、 Material from Halogen、
Tg175℃ FR－4、High CTI materials, CAF-resistant materials |
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other technics
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India carbon oil, and India can be separated oil silver paste filling holes
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